Jacksjoke
2019-1-11 22:00:24
AMD backend orders for new 7nm chips split between 3 firms
TSMC with its CoWoS (chip-on-wafer-on-substrate) packaging has grabbed orders for AMD's 7nm datacenter CPU, while SPIL and TFME share the flip-chip packaging orders placed by AMD for its new 7nm CPU and GPU designed for desktops and notebooks, the sources indicated.
唔係4k都好易跑144Hz